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Isonics Silicon Products and Services Division – Wafer ReclaimIsonics’ wafer reclaim process starts with 100% inspection of incoming wafers. The appropriate strip and etch chemistry is determined based on inspection results. An additional pre-treatment is applied for wafers containing metal films to ensure all wafers remain metal-free through our processes. 
After lapping and/or grinding and polishing to meet customer specifications, the wafers are transported to Isonics’ Class1 clean room for multi-stage cleaning which ensures low surface metal level, typically well below 1E10 atoms per cm2. After ultra-pure cleaning, the wafers are inspected using our state-of-the-art KLA-Tencor SP-1/TBI or SP-1/DLS laser particle scanner, the same inspection tool used by top-tier semiconductor manufacturers. All reclaim wafers are returned to the customer.
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